OM-353 Solder Paste

ALPHA OM-353 is a is a No-Clean, Lead-Free, Zero-Halogen, ROL0, Ultra-Fine Feature Print & Air Reflow Capable Solder Paste: OM-353 Paste Tube and Jar Type 4 & Type 5 no-clean paste Available in 500 gram jars, 6 & 12 cartridges Available in SAC305, SAC105, SACX Plus 0307, Maxrel, & Maxrel Plus alloys Assembly processes that can gain from ALPHA OM-353 Solder Paste are: Assemblies with fine features Assemblies sensitive to component warpage Processes that currently require cleaning Components sensitive to flux wicking Assemblies which do not require SAC305 ALPHA OM-353 key attributes are: Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out. High Tack Force Life: ensures high pick-and-place yields, good self-alignment. Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170C to 180C. Reduced Mid Chip Solder Balling, Head-in-Pillow: minimizes rework and increases first time yield Air Reflow Capable: shown to yield good coalescence for 160m circle deposits using an air reflow high soak. Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after