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Emerson & Cuming


Emerson & Cuming understands the unique needs of circuit and component assembly. Their products have been designed for ease of use and process transparency:

  • Engineered material solutions provide mechanical integrity and ruggedization for delicate parts
  • Electrically conductive materials provide electrical interconnect or ground plane continuity in multiple configurations
  • Encapsulants and coatings protect electronics in the most severe environments

The product line offers a wide range of solutions for industrial electronics customers, including:

  • Underfills for CSP, BGA, and Flip Chip
  • Electrically conductive adhesives
  • Electrically conductive coatings
  • Film adhesives
  • Thermal interface materials
  • Encapsulants
  • Chip on board die attach adhesives
  • Chip on board encapsulants
  • Surface mount adhesives
  • Conformal coatings