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| Alpha: No-Clean and Water Soluble Solder Pastes |
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ALPHA solder pastes that cover the complete range of applications, including no-clean, water-soluble and lead-free technologies.
ALPHA OM-338
Ultra Fine Feature Lead-Free Solder Paste
Lead-free, no-clean solder paste formulated for both standard and fine pitch stencil printing. This product's wide processing window is designed to minimize transition concerns from tin/lead to lead-free solder paste.
Features and Benefits include:
Print speeds of between 25mm/sec (1"/sec) and 200mm/sec (8"/sec)with high volume repeatability
Maximizes reflow for lead-free processing, allowing full alloy coalescence
Reduction in random solderballing levels, minimizing rework and increasing first-time yield
Excellent solder and flux cosmetics after reflow soldering
Meets highest IPC 7095 voiding performance classification of Class III
Excellent reliability properties, halide-free material
Compatible with either nitrogen or air reflow
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